FCBGA
Production Information
Features
- Package Size: 8 x 8 mm up to 67.5x67.5 mm
- Line & Space 9/12 um
- Bump Pitch down to 110 um
- Impedance control for critical signal traces
- Structure range from 1/2/1 to 8/2/8
- Auto grade 0 reliability test
Benefits
- High/mid/low end chip product lineup
- Good electrical performance
- Good ability for heat dissipation
Applications
- PC CPU/GPU/Chipset
- High Performance Computing, AI
- Server/Switch
- 5G Networking Infrastructure e.g. base station
- ASIC devices